• Non-Destructive Testing: For components like BGAs (Ball Grid Arrays), QFNs (Quad Flat No-leads), and other hidden solder joints, our X-ray machines provide a non-invasive way to verify solder quality and component placement beneath the surface.
• Void Detection: X-ray inspection is crucial for detecting voids in solder joints which could lead to reliability issues over time. We use sophisticated software to analyze these voids against industry standards.
• Multi-angle Imaging: Our systems can rotate and tilt PCBs to inspect from multiple angles, ensuring comprehensive coverage of all critical areas.